Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
7
06/12
相关PDF资料
B82476A1102M INDUCTOR POWER 1.0UH 6.8A SMD
B82477G2474M INDUCTOR POWER 470UH 580MA SMD
B82477G4103M INDUCTOR POWER 10UH 5.4A SMD
B82477R4334M100 INDUCTOR POWER 330UH 1.12A SMD
B82479A1473M INDUCTOR POWER 47UH 2.6A SMD
B82496C3129A INDUCTOR 1.2NH 1.8A 0603
B82498F3569M INDUCTOR 5.6NH 900MA 0805 20%
B82559A0392A013 INDUCTOR POWER 3.9UH 12A SMD
相关代理商/技术参数
B82472G4103M000 制造商:TDK Epcos 功能描述:Ind Power Shielded Wirewound 10uH 20% 100KHz Ferrite 1.7A Blister T/R
B82472G4104M 功能描述:固定电感器 100uH 0.45A 20 % 7.3x7.3mm SMD RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
B82472G4105M 功能描述:固定电感器 1mH 0.18A 20 % 7.3x7.3mm SMD RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
B82472G4152M 功能描述:固定电感器 1.5uH 3.35A 20 % 7.3x7.3mm SMD RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
B82472G4152M000 功能描述:FIXED IND 1.5UH 3.35A 20 MOHM 制造商:epcos (tdk) 系列:B82472G4 包装:带卷(TR) 零件状态:在售 类型:绕线 材料 - 磁芯:铁氧体 电感:1.5μH 容差:±20% 额定电流:3.35A 电流 - 饱和值:2.6A 屏蔽:屏蔽 DC 电阻(DCR):20 毫欧最大 不同频率时的 Q 值:- 等级:- 工作温度:-55°C ~ 125°C 频率 - 测试:100kHz 安装类型:表面贴装 封装/外壳:非标准 供应商器件封装:- 大小/尺寸:0.287" 长 x 0.287" 宽(7.30mm x 7.30mm) 高度 - 安装(最大值):0.138"(3.50mm) 标准包装:1,000
B82472G4153M 制造商:TDK-EPC 功能描述:Ind Power Shielded Wirewound 15uH 20% 100KHz Ferrite 1.4A Blister T/R 制造商:TDK-EPC 功能描述:SMT-INDUCTOR 7X 7 15 UH 1,10 A - Tape and Reel 制造商:TDK-EPC 功能描述:SMT-INDUCTOR 7X7 15UH 1.10A 制造商:TDK-EPC 功能描述:INDUCTOR POWER 15uH
B82472G4153M000 功能描述:固定电感器 15uH 1.1A 20 % 7.3x7.3mm SMD RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm
B82472G4154M 功能描述:固定电感器 150uH 490mA 20 % 7.3x7.3mm SMD RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm